ARCTIC CERAMIQUE PREMIUM THERMAL COMPOUND (2.5 GRAM) CMQ-2.5G CPU COOL

	ARTIC CERAMIQUE PREMIUM HIGH-DENSITY THERMAL COMPOUND (2.7 GRAM)
	ARTIC CERAMIQUE PREMIUM HIGH-DENSITY THERMAL COMPOUND

	Shipping Extra
	ATACOM Part #: THER_ARCT_SL_17
	Price: $10.95



	The high-density, ceramic-based thermal compound specifically designed for modern high-power CPUs and high-performance heatsinks or water-cooling solutions. Made with micronized aluminum oxide, boron nitride and zinc oxide. Ceramique uses a high-density layered composite of five unique shapes of thermally conductive aluminum oxide, boron nitride and zinc oxide sub-micron particles to maximize particle-to-particle contact area and thermal transfer. This exclusive combination provides performance exceeding most metal based compounds. Average particle size: 0.38 microns <0.000015 inch ( 67 particles lined up in a row equal 1/1000th of an inch. ) High-density, ceramic-based thermal compound. Made with micronized aluminum oxide, boron nitride and zinc oxide o maximize particle-to-particle contact area and thermal transfer. The compound thickens slightly over the first 100 to 300 hours of use to its final consistency designed for long-term stability. It will take a minimum of 12 hours to achieve maximum particle to particle thermal conduction and for the heatsink to CPU interface to reach maximum conductivity. Ceramique can easily be cleaned from CPUs and heatsinks with isopropyl alcohol or any of the cleaners listed in the product instructions. Does not contain any metal or other electrically conductive materials. It is a pure electrical insulator, neither electrically conductive nor capacitive. Temperature Limits - Peak: – 40°C to >180°C, Long-Term: – 40°C to 140°C 2 to 10 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads. *Installation Instructions