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nVidia TESLA C2050 3GB
w/ 448 Cores

Innodisk iCF4000 Industrial Card

OCZ VTX3MI-25SAT3-120G 120GB Vertex 3 Max IOPS SSD

Supermicro SYS-6017B-NTF 1U LGA1356

Tyan S5512GM2NR C204 DDR3 LGA1155

DYNATRON H53G 2U PASSIVE COPPER HEATSINK INTEL LGA771
Images shown for reference only
DYNATRON H53G 2U PASSIVE COPPER HEATSINK INTEL LGA771 Intel Xeon Dempsey, Woodcrest, Quad-Core Clovertown MV, Clovertown LV: H53G  
 
Shipping Extra  
ATACOM Part #: FA4J_DYNA_H5_3G  
   Price: $39.95

  
CPU Socket 771
CPU Support Intel® Xeon® Dempsey, Woodcrest, Quad-Core Clovertown MV & Clovertown LV
Solution 2U&Up
Overall Dimension 90.0 x 78.5 x 52.0 mm
Weight 895 g
Material Copper Heatsink
Fan Dimension -
Speed -
Bearing -
Rated Voltage -
Power -
Air Flow -
Noise Level -
Air Pressure -
Lead Wire Pin Out -
 RoHS Compliance
 
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