The high-density, ceramic-based thermal compound specifically
designed for modern high-power CPUs and high-performance heatsinks
or water-cooling solutions. Made with micronized aluminum oxide,
boron nitride and zinc oxide. Ceramique uses a high-density
layered composite of five unique shapes of thermally conductive
aluminum oxide, boron nitride and zinc oxide sub-micron particles
to maximize particle-to-particle contact area and thermal transfer.
This exclusive combination provides performance exceeding most
metal based compounds. Average particle size: 0.38 microns <0.000015
inch ( 67 particles lined up in a row equal 1/1000th of an inch.
High-density, ceramic-based thermal compound.
Made with micronized aluminum oxide, boron nitride and
zinc oxide o maximize particle-to-particle contact area
and thermal transfer.
The compound thickens slightly over the first 100 to
300 hours of use to its final consistency designed for long-term
stability. It will take a minimum of 12 hours to achieve
maximum particle to particle thermal conduction and for
the heatsink to CPU interface to reach maximum conductivity.
Ceramique can easily be cleaned from CPUs and heatsinks
with isopropyl alcohol or any of the cleaners listed in
the product instructions.
Does not contain any metal or other electrically conductive
materials. It is a pure electrical insulator, neither electrically
conductive nor capacitive.
Temperature Limits - Peak: – 40°C to >180°C,
Long-Term: – 40°C to 140°C
2 to 10 degrees centigrade lower CPU full load core temperatures
than standard thermal compounds or thermal pads.