DYNATRON G129 1U PASSIVE COPPER HEATSINK INTEL LGA1366
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DYNATRON G129 1U PASSIVE COPPER HEATSINK INTEL LGA1366 for Intel Xeon 5500 Series Nehalem EP Processor. BACKPLATE NOT INCLUDED: G129  
 
Shipping Extra  
ATACOM Part #: FA13_DYNA_G1_29  
   Price: $33.95

  
Socket 1156
CPU Intel® Core™ i5 I5-750; Xeon® Processor 3400 Series; Core™ i7 Processors, I7-870 & I7-860
Solution 1U
Overall Dimension 90.0 x 90.0 x 26.5 mm
Weight 490g ± 5g
Material Copper Heatsink
DYNATRON G129 1U PASSIVE COPPER HEATSINK INTEL LGA1366
 



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