Essentials Capacity 256 GB Lithography Type 64-Layer 3D TLC NAND Use Conditions Server/Enterprise

	Performance Sequential Read (up to) 2200 MB/s Sequential Write (up to) 280 MB/s Random Read (100% Span) 125000 IOPS Random Write (100% Span) 5700 IOPS Power - Active 4.0W Power - Idle 0.7W

	Reliability Vibration - Operating 2.17GRMS Vibration - Non-Operating 3.13GRMS Shock (Operating and Non-Operating) 1000 G/0.5 ms Operating Temperature Range 0oC to 70oC Mean Time Between Failures (MTBF) 1.6 million hours Uncorrectable Bit Error Rate (UBER) <1 sector per 1015 bit read

	Package Specifications Form Factor M.2 22 x 80mm Interface PCIe NVMe 3.1 x4

	Advanced Technologies Enhanced Power Loss Data Protection No Hardware Encryption AES 256 bit High Endurance Technology (HET) No Temperature Monitoring and Logging No End-to-End Data Protection No Intel Smart Response Technology No Intel Remote Secure Erase No Intel Rapid Start Technology No

	Item Dimension (L"xW"xH") 5 x 1 x 4

	Weight 1.00 LB

	Warranty Information 5 Years